Contact Pad for Semiconductor Devices

摘要

Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad disposed over a substrate, and a passivation layer and/or polymer layer disposed over the substrate and a portion of the contact pad. A post passivation interconnect (PPI) line is disposed over the passivation layer and is coupled to an exposed portion of the contact pad. A PPI pad is disposed over the passivation layer. A transition element is disposed over the passivation layer and is coupled between the PPI line and the PPI pad. The transition element includes line having a width greater than the PPI line.

主权项

1. A semiconductor structure comprising:
a substrate having a contact pad thereon; an insulating layer over the substrate, wherein a portion of the contact pad is exposed; and a conductive interconnect electrically coupled between the contact pad and an external connection, the conductive interconnect having a first line portion, a pad portion, and a second line portion interposed between the first line portion and the pad portion, a width of the second line portion being greater than a width of the first line portion, the second line portion having substantially parallel sidewalls.