DEVICE AND METHOD FOR ALIGNMENT OF VERTICALLY STACKED WAFERS AND DIE

摘要

A device is provided that includes a first die having a first alignment structure that includes a plurality of first transmission columns arranged in a pattern and a second die positioned on the first die, the second die having a second alignment structure that includes a plurality of second transmission columns arranged in the same pattern as the first transmission columns. The first and second transmission columns are each coplanar with a first surface and a second surface of the first and second die, respectively.

主权项

1. A method of aligning a plurality of die, comprising:
positioning a first die having a first plurality of alignment structures overlying a second die having a second plurality of alignment structures, the first plurality of alignment structures having a first plurality of transmission columns arranged in a pattern and the second plurality of alignment structures having a second plurality of transmission columns arranged in the pattern of the first transmission columns; applying a first signal to the first plurality of alignment structures; detecting a second signal at the second plurality of alignment structures; determining a difference between the first and second signals; and adjusting a position of the first die with respect to the second die to decrease the difference between the first and second signals.