| 发明名称 |
SEMICONDUCTOR PACKAGE, CARRIER STRUCTURE AND FABRICATION METHOD THEREOF |
| 摘要 |
A semiconductor package is provided, which includes: a carrier; a frame having a plurality of openings, wherein the frame is bonded to the carrier and made of a material different from that of the carrier; a plurality of electronic elements disposed in the openings of the frame, respectively; an encapsulant formed in the openings of the frame for encapsulating the electronic elements; and a circuit layer formed on and electrically connected to the electronic elements. By accurately controlling the size of the openings of the frame, the present invention increases the accuracy of positioning of the electronic elements so as to improve the product yield in subsequent processes. |
| 申请公布号 |
US2016079110(A1) |
申请公布日期 |
2016.03.17 |
| 申请号 |
US201514849639 |
申请日期 |
2015.09.10 |
| 申请人 |
Siliconware Precision Industries Co., Ltd. |
发明人 |
Chuang Kuan-Wei;Chiu Shih-Kuang;Lin Chun-Tang;Huang Jung-Pang |
| 分类号 |
H01L21/683;H01L21/56;H01L23/00;H01L23/31;H01L23/528 |
主分类号 |
H01L21/683 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package, comprising:
a carrier; a frame having a plurality of openings, wherein the frame is bonded to the carrier and made of a material different from that of the carrier; a plurality of electronic elements disposed in the openings of the frame, respectively; an encapsulant formed in the openings of the frame for encapsulating the electronic elements; and a circuit layer formed on and electrically connected to the electronic elements. |
| 地址 |
Taichung TW |
