VACUUM CARRIER INTERFACE HAVING A SWITCHABLE REDUCED CAPACITY AIRLOCK CHAMBER

摘要

A vacuum carrier interface configured to interface with a transfer module, the vacuum carrier interface including an input interface configured to receive one or more substrates at atmospheric pressure; a substrate handling manifold configured to receive the one or more substrates from the input interface at atmospheric pressure and interface with the transfer module in a vacuum; an output interface configured to deliver one or more substrates to the transfer module from the substrate handling manifold; a vacuum manifold base plate and a lower pedestal, which are spaced apart, the vacuum manifold base plate and the lower pedestal forming a chamber between a lower surface of the vacuum manifold base plate and an upper surface of the lower pedestal; and an indexer configured to raise and lower the vacuum manifold base plate and the lower pedestal.

主权项

1. A vacuum carrier interface configured to interface with a transfer module, the vacuum carrier interface comprising:
an input interface configured to receive one or more substrates at atmospheric pressure; a substrate handling manifold configured to receive the one or more substrates from the input interface at atmospheric pressure and interface with the transfer module in a vacuum; an output interface configured to deliver one or more substrates to the transfer module from the substrate handling manifold; a vacuum manifold base plate and a lower pedestal, which are spaced apart, the vacuum manifold base plate and the lower pedestal forming a chamber between a lower surface of the vacuum manifold base plate and an upper surface of the lower pedestal; and an indexer configured to raise and lower the vacuum manifold base plate and the lower pedestal, wherein the vacuum manifold base plate and the lower pedestal in a lowered position form a vacuum indexer above the vacuum manifold base plate, and the vacuum manifold base plate and the lower pedestal in a raised position form an airlock chamber between the lower surface of the vacuum manifold base plate and the upper surface of the lower pedestal when the vacuum manifold base plate and the lower pedestal is placed within the substrate handling manifold.