| 摘要 |
PROBLEM TO BE SOLVED: To provide a microcapsule for curing an epoxy resin which is capable of exhibiting excellent storage stability, thermal stability, and quick curability when blended into an epoxy resin composition, and to provide an epoxy resin composition containing the microcapsule for curing an epoxy resin.SOLUTION: The microcapsule for curing an epoxy resin comprises a core agent and a shell layer arranged on the surface of the core agent. The core agent is a basic curing agent and/or a curing accelerator, and the microcapsule for curing an epoxy resin contains 10-24 wt.% of the core agent and 10-90 wt.% of an acidic polymer in 100 wt.% of the microcapsule.SELECTED DRAWING: None |
