DETACH CORE SUBSTRATE AND METHOD FOR MANUFACTURING THEREOF

摘要

The present invention relates to a detach core substrate and a method of manufacturing a detach core substrate. In accordance with one embodiment of the present invention, there is proposed a detach core substrate that a conductive layer including a metal layer with an etching property different from copper is formed on a top surface and a bottom surface of an insulating layer formed thereon a surface roughness. At this time, the contact interface between the top surface and the bottom surface of the insulating layer is the detachment interface to be separated during the manufacture of the circuit board. In addition, a method of manufacturing the detach core substrate is proposed.

主权项

1. A detach core substrate comprising:
an insulating layer provided with a top surface and a bottom surface where surface roughness is formed; and conductive layers including a metal layer with an etching property different from copper and formed on the top surface and the bottom surface of the insulating layer, respectively, wherein interfaces between the top surface and the bottom surface of the insulating layer and the conductive layers are detachment interfaces to be separated during manufacturing a circuit board.