发明名称 METHOD FOR SHORTENING THE PROCESS TIME DURING THE SOLDERING OF ELECTRIC OR ELECTRONIC COMPONENTS BY MEANS OF ELECTROMAGNETIC INDUCTION HEATING
摘要 The invention relates to a method for shortening the process time during the soldering of electric or electronic components by means of electromagnetic induction heating, in particular the soldering of electric contact elements to solder connection surfaces that are applied to a non-metallic substrate, in particular a pane of glass. According to the invention, an electric contact element is first produced, designed as a solder foot, made of a material with an iron-nickel or iron-chromium alloy base. Subsequently, a lead-free connecting material is applied to the solder foot. After the solder foot has been positioned on the respective solder connection surface, the solder foot is inductively heated by means of high frequency energy with increased heating of the solder foot material and reduced heating of the silver-containing material of the respective solder connection surface. The soldering stage is completed after a time of <10 s, in particular within a time of <4 to 6s. The invention also relates to a contact element in the form of a special solder foot.
申请公布号 WO2016038144(A1) 申请公布日期 2016.03.17
申请号 WO2015EP70730 申请日期 2015.09.10
申请人 FEW FAHRZEUGELEKTRIKWERK GMBH & CO. KG 发明人 JENRICH, ANDRÉ
分类号 B23K1/002;B23K1/00;B23K1/19;B23K103/00;B23K103/04;H01R4/02 主分类号 B23K1/002
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