发明名称 MODULAR STRUCTURE, FOR RAISED FLOORS AND THE LIKE
摘要 A modular structure for building raised floors comprising a plurality of panels (2), which can be mutually coupled and placed on an underlying ground to provide a covering platform. The modular structure comprises a conditioning unit (3), such as a heat pump, through which a gas flows which is affected by a heat exchanger (4) and can be activated selectively to heat or cool a heat transfer fluid that circulates inside a duct (5) that the heat exchanger (4)with the panels (2). The duct (5) comprises at least one outgoing portion (7) and at least one return portion (8), which are arranged in series and are constituted respectively by a plurality of outgoing portions (7a) and of return portions (8a). At least one outgoing portion (7a) and at least one return portion (8a) are accommodated in at least one respective panel (2), selectively to transfer heat to the outside or absorb heat from the outside.
申请公布号 EP2994698(A1) 申请公布日期 2016.03.16
申请号 EP20140732385 申请日期 2014.05.09
申请人 D-MATIC S.R.L. 发明人 PERRI, DAVIDE
分类号 F24D3/14;E01C11/26;F24D3/16 主分类号 F24D3/14
代理机构 代理人
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