METHOD AND DEVICE FOR LASER CUTTING PROCESS

摘要

A laser cutting method and a laser cutting apparatus cut a metallic work with a laser beam of a one-micrometer waveband. The method and apparatus carry out the laser cutting of the work with a ring beam RB passed through a focus position of a condenser lens 13 and having inner and outer diameters that tend to expand. The outer diameter of the ring beam is in a range of 300 µm (micrometers) to 600 µm, an inner diameter ratio of the same is in a range of 30% to 70%, and a focal depth of the condenser lens is in a range of 2 mm to 5 mm.