发明名称 実装ランド構造体及び積層コンデンサの実装構造体
摘要 A mounting land structure and a mounting structure include land patterns to be bonded to outer electrodes of a laminated ceramic capacitor. Each of the land patterns includes a first conductor pattern and a second conductor pattern separated from each other in a width direction and a third conductor pattern connecting the first conductor pattern and the second conductor pattern. The first conductor pattern and the second conductor pattern include respective portions to be bonded to first ridgeline portions of the laminated ceramic capacitor provided with the outer electrodes. The third conductor pattern is arranged at a position overlapping the corresponding outer electrode as viewed in a height direction, when the laminated ceramic capacitor is mounted.
申请公布号 JP5888281(B2) 申请公布日期 2016.03.16
申请号 JP20130101185 申请日期 2013.05.13
申请人 株式会社村田製作所 发明人 服部 和生;藤本 力
分类号 H01G2/06;H05K1/18;H05K3/34 主分类号 H01G2/06
代理机构 代理人
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