| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition that enables the formation of a fine pattern even when the resin composition is formed into a film having a large thickness, has an excellent visible light transmissivity, and also has excellent heat resistance to such an extent that it undergoes less resin discoloration even when subjected to a long-term high-temperature thermal history; a photosensitive resin film produced; and an electronic component using them. <P>SOLUTION: A photosensitive resin composition comprises a photopolymerizable compound having at least one ethylenically unsaturated group (A), a photopolymerization initiator (B), and a compound having a hindered phenolic structure (C), where the (A) component contains a (meth)acrylate compound. <P>COPYRIGHT: (C)2013,JPO&INPIT |
