发明名称 ヒートポンプ温水暖房装置
摘要 <P>PROBLEM TO BE SOLVED: To provide a compact heat pump hot water heating device which is superior in workability and maintainability. <P>SOLUTION: A heat pump hot water heating device includes: a coolant circuit 8 connecting a compressor 4, a water coolant heat exchanger 5, a decomporessor 6, and an evaporator 7; a heat source machine 1 receiving the coolant circuit 8; an external radiator 2 for circulating a heat medium heated at the water coolant heat exchanger 5 and radiating heat; an opening-closing valve 24 arranged at a heat medium circulation channel between the water coolant heat exchanger 5 and the external radiator 2; a heat medium outgoing port 20 and a heat medium returning port 22 which connect the heat source machine 1 and the external radiator 2 via a pipe; and a housing 35 forming the heat source machine 1, wherein the opening-closing valve 24, the heat medium outgoing port 20, and the heat medium returning port 22 are arranged as protruding from the housing 35. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5887484(B2) 申请公布日期 2016.03.16
申请号 JP20110221613 申请日期 2011.10.06
申请人 パナソニックIPマネジメント株式会社 发明人 中谷 和人;池田 英和;野村 正和;三原 広司
分类号 F24D3/00;F24D3/10 主分类号 F24D3/00
代理机构 代理人
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