METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

Provided is a method for manufacturing a semiconductor device. The manufacturing method includes the following steps: forming a hard mask film including a lower portion on a lower structure and an upper portion on the lower portion, wherein the hard mask film is made of a photosensitive hard mask material; and performing an exposure and development process on the hard mask film and removing an upper portion of the hard mask film to form a hard mask structure having a flat upper surface. According to the manufacturing method, the hard mask film is flattened by using the exposure and development process, thereby simplifying a process and improving productivity.