| 摘要 |
PROBLEM TO BE SOLVED: To provide an individual piece manufacturing method capable of simplifying an individual piece manufacturing step.SOLUTION: An individual piece manufacturing method comprises the steps of: preparing a wafer WF as a plate-like member (plate-like member preparing step); laminating a fixing member 10 on both surfaces of the wafer WF (laminating step); forming thin-sliced wafers WF1 and WF2 as a thin-sliced plate-like member from the wafer WF by forming a notch 11 along one surface or the other surface of the wafer WF from a side surface of the wafer WF laminated with the fixing member 10 (notch forming step); and forming a semiconductor chip CP as a plurality of individual pieces with a fixing member 10 by cutting the thin-sliced wafers WF1 and WF2 together with the fixing member 10 (thin-sliced plate-like member cutting step).SELECTED DRAWING: Figure 2 |
