VIA SYSTEM OF PRINTED CIRCUIT BOARD AND METHOD OF MAKING SAME

摘要

A printed circuit board (PCB) includes a top outer layer, a bottom outer layer, a signal transmission layer, an inner signal transmission layer, and a via system defined in the PCB. The via system includes two pairs of vias configured to transmit signals from a transmitter to a receiver. A signal transmission pathway is defined in the top outer layer, the signal transmission layer, and the inner signal transmission layer. Signals are sent from the transmitter to a first pair of vias, the signals are transmitted from the first pair of vias to a second pair of vias, and the signals are sent from the second pair of vias to the receiver. The two pairs of vias and the signal transmission pathway provide impedance matching to the signals.

主权项

1. A printed circuit board (PCB) comprising:
a top outer layer; a bottom outer layer; a signal transmission layer; an inner signal transmission layer; and a via system defined in the PCB; wherein the via system is configured for routing a signal transmission line and comprises a first pair of vias and a second pair of vias, the first pair of vias and the second pair of vias each comprising a first via and a second via; the first via and the second via both extend through the top outer layer, the signal transmission layer, the inner signal transmission layer, and the bottom outer layer; the second via is located closer to a side edge of the PCB than the first via; a first signal transmission pathway of the via system is defined in the top outer layer and connects a transmitter to the second via of a first pair of vias; a second signal transmission pathway of the via system is defined in the inner signal transmission layer and connects the second via of the first pair of vias to the first via of the first pair of vias; a third signal transmission pathway of the via system is defined in the signal transmission layer and connects the first via of the first pair of vias to the first via of the second pair of vias; a fourth signal transmission pathway of the via system is defined in the inner signal transmission layer and connects the first via of the second pair of vias to the second via of the second pair of vias; a fifth signal transmission pathway of the via system is defined in the top outer layer and connects the second via of the second pair of vias to a receiver; a signal is sent from the transmitter to the second via of the first pair of vias through the first signal transmission pathway; the signal is transmitted from the second via of the first pair of vias to the first via of the first pair of vias through the second signal transmission pathway; the signal is transmitted from the first via of the first pair of vias to the first via of the second pair of vias through the third signal transmission pathway; the signal is transmitted from the first via of the second pair of vias to the second via of the second pair of vias through the fourth signal transmission pathway; and the signal is transmitted from the second via of the second pair of vias to the receiver through the fifth signal transmission pathway.