| 摘要 |
Provided are a method for manufacturing electronic devices and a method for manufacturing glass laminates. The method for manufacturing a glass substrate as a component of an electronic device ensures the smoothness of the surface of the glass substrate even when the electronic device is formed or the component for the electronic device is peeled off from the glass substrate, and suppresses the lowering of the product yield of the component of the electronic device. The method for manufacturing the electronic device comprises the steps of a laminating step where a supporting substrate with a resin layer and a glass substrate are laminated to obtain a stripped laminate, a grinding step for grinding the second main surface of the glass substrate, a component forming step for forming the component of the electronic device on the grinded second main surface, a separation step for separating the glass substrate where the component of the electronic device is laminated from the supporting substrate with a resin layer to obtain the electronic device comprising the component of the electronic device and a glass substrate. The surface waveness of the exposed surface of the resin layer when calculated based on the waveness of a filter center line (WCA) is under 0.1um. |
