| 摘要 |
The present invention relates to a dicing tape-integrated film for the back surface of a semiconductor, comprising a dicing tape including a base material having an asperities-formed surface, and an adhesive layer laminated on the base material; and a film for the back surface of a semiconductor laminated on the adhesive layer of the dicing tape, wherein the dicing tape has a haze of at most 45%. The purpose of the present invention is to provide a dicing tape-integrated film for the back surface of a semiconductor having high light transmittance in inspection of semiconductor chips after a dicing process, and having excellent visibility of a semiconductor chip image, a manufacturing method thereof, and a method for manufacturing a semiconductor device using the film. |
