| 摘要 |
The present invention provides a two-side covering metal laminated plate with high heat resistance, which suppresses a micropore generated between a metal layer and a polyimide resin layer, and suppresses circuit stripping caused by permeation of acid cleaning solution by raising bonding reliability between the metal layer and the polyimide resin layer. The two-side covering metal laminated plate of the present invention has a laminated structure consisting of a first polyimide resin layer having a linear humidity expansion factor less than 20*10<-6>/%RH and a second polyimide resin layer with a glass-transition temperature more than 300 DEG C and less than the glass-transition temperature of the first polyimide resin layer, preferredly the two-side covering metal laminated plate formed by bonding of the two-side metal layer and the polyimide resin layer through a coating method. |
