| 摘要 |
The invention relates to a method and device for treating a substrate by means of a plasma. In the method, a plasma is produced by means of a plurality of plasma units, wherein first an ignition power is fed into at least one first plasma unit in order to produce a plasma adjacently thereto in a first plasma region. Subsequently or simultaneously thereto, a power is fed into at least one second plasma unit, said power being significantly less than the ignition power of the second plasma unit but being sufficient to maintain an already ignited plasma adjacently to the second plasma unit, wherein the second plasma unit lies adjacent to the first plasma unit in such a way that the first plasma region overlaps an emission region of the second plasma unit. By means of the already ignited plasma in the first plasma region and the power fed into the second plasma unit, a plasma is then ignited in the plasma region of the second plasma unit. The device comprises a plurality of adjacent plasma units for producing a plasma in a plasma region of the plasma units, wherein the plasma units are arranged in such a way that the plasma region of at least one first plasma unit overlaps an emission range of at least one adjacent second plasma unit. A control arrangement is provided, which is suitable for controlling at least the first and second plasma units independently of each other. |
