发明名称 発光装置
摘要 <P>PROBLEM TO BE SOLVED: To provide a light emitting device having flexibility, and also capable of reducing an optical loss caused by the absorption of LED chip light into a substrate or the like. <P>SOLUTION: The light emitting device includes: an insulation film; a plurality of conductive members disposed on the insulation film to be separated from each other; and an LED chip mounted over a pair of adjacent conductive members. The insulation film has a through hole formed so as to communicate from an upper face to a rear face, the through hole is provided at a position including a lower part of the LED chip between adjacent conductive members, and an insulating light reflection material is filled in the through hole. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5885922(B2) 申请公布日期 2016.03.16
申请号 JP20100292810 申请日期 2010.12.28
申请人 日亜化学工業株式会社 发明人 藤川 康夫;竹田 英明
分类号 H01L33/60 主分类号 H01L33/60
代理机构 代理人
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