发明名称 発光装置、回路基板、発光装置用パッケージアレイ、及び発光装置用パッケージアレイの製造方法
摘要 A light emitting device includes a light emitting element and a package. The package is made up of a molded article and a lead that is embedded in the molded article. The lead includes a mounting part on which the light emitting element is mounted, a terminal part that is linked to the mounting part, and an exposed part. The package has a front face that is a light emitting face, a rear face opposite the front face, and a bottom face contiguous with the front face and the rear face. The light emitting element is mounted on the front face side of the mounting part. The exposed part is linked to the rear face side of the mounting part, and is exposed from the molded article at the bottom face and the rear face. The terminal part is exposed from the molded article at the bottom face.
申请公布号 JP5888236(B2) 申请公布日期 2016.03.16
申请号 JP20120531959 申请日期 2011.09.01
申请人 日亜化学工業株式会社 发明人 山下 良平
分类号 H01L33/64;H01L33/62 主分类号 H01L33/64
代理机构 代理人
主权项
地址
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