| 摘要 |
The present invention provides a method for producing a resist composition used in a process for producing a semiconductor apparatus, the method including the steps of:
cleaning an apparatus for producing the resist composition with a cleaning liquid;
applying the cleaning liquid on an evaluation substrate by spin-coating after removing the cleaning liquid from the apparatus for producing the resist composition;
repeating the step of cleaning and the step of applying until the change in the density of defects having a size of 100nm or more on the evaluation substrate between before and after the application of the cleaning liquid becomes 0.2/cm 2 or less; and
producing the resist composition by using the apparatus for producing the resist composition after the step of repeating.
There can be provided a method for producing a resist composition capable of producing a resist composition whose coating defects are reduced. |
