| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a sheet for wafer processing which easily reduces the costs and enables easy disposal, and to provide a manufacturing method of the sheet for the wafer processing. <P>SOLUTION: An adhesive sheet S1 is applied to a wafer W and a ring frame RF and thereby causing the ring frame RF to hold the wafer W. The adhesive sheet S1 includes: a base material sheet BS; a magnetic recording layer ML laminated on one surface of the base material sheet BS and recording predetermined information; and an adhesive layer AD laminated on the base material sheet BS so as to cover the magnetic recording layer ML. <P>COPYRIGHT: (C)2013,JPO&INPIT |
