| 摘要 |
Electronic package 100 that includes an electrically conductive pad 112, a package insulator layer including a non-conductive material, the package insulator layer 102 being planar, and a via 106; the via is formed within the package insulator layer and electrically coupled to the electrically conductive pad; the via includes a conductor extending vertically through at least part of the package insulator layer and having a first end proximate the electrically conductive pad and a second end opposite the first end and a finish layer 110 secured to the second end of the conductor, the finish layer including a gold compound. The first via may comprise a second via where the first and second vias may be made of different conductive materials. The pad may be coupled to a silicon bridge which may also comprise ceramic or organic interposers. |
