发明名称 回路基板の補強位置決定方法及び基板組立体
摘要 A method of determining a reinforcement position of a circuit board includes: setting a numerical model of a circuit board in which an electronic component is mounted in a front surface by bumps, and a reinforcing member is attached to a position corresponding to a bump located in a corner part of the electrical component in a back surface; incorporating information about a stud that is located in a periphery of the electronic component and fixes the circuit board to a chassis of the electronic device; performing a simulation for obtaining values of stresses generated in bumps of corner parts when a force is applied to the electronic component from a back side of the circuit board; and determining an arrangement of the reinforcing member in accordance with a position of the stud based on the values of stresses obtained by the simulation.
申请公布号 JP5884435(B2) 申请公布日期 2016.03.15
申请号 JP20110255535 申请日期 2011.11.22
申请人 富士通株式会社 发明人 小林 弘;江本 哲;岡田 徹;北嶋 雅之;増山 卓己
分类号 G06F17/50;H05K1/02;H05K1/18;H05K3/00 主分类号 G06F17/50
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