发明名称 Wavelength-converting light emitting diode (LED) chip and LED device equipped with chip
摘要 A wavelength-converted light emitting diode (LED) chip is provided. The wavelength-converted LED chip includes an LED chip and a wavelength-converted layer. The LED chip emits light in a predetermined wavelength region. The wavelength-converted layer is formed of a resin containing phosphor bodies of at least one kind which convert a portion of the light emitted from the LED chip into light in a different wavelength region. The wavelength-converted layer is formed on an upper surface of the LED chip, and has a convex meniscus-shaped upper surface.
申请公布号 US9287470(B2) 申请公布日期 2016.03.15
申请号 US201514600741 申请日期 2015.01.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 Kim Yong Tae;Lee Dong Yeoul
分类号 H01L33/50;H01L33/54;H01L33/56;H01L33/58 主分类号 H01L33/50
代理机构 McDermott Will & Emery LLP 代理人 McDermott Will & Emery LLP
主权项 1. A wavelength-converted light emitting diode (LED) chip comprising: an LED chip for emitting light in a predetermined wavelength region; and a wavelength-converted layer formed of a resin containing phosphors of at least one kind which converts a portion of the light emitted from the LED chip into light in a different wavelength region, disposed on an upper surface of the LED chip, and having a convex meniscus-shaped upper surface whose boundary is defined by an edge of the upper surface of the LED chip, wherein a plurality of uneven portions are formed in the upper surface of the LED chip, wherein the phosphors of the at least one kind comprise phosphors of various kinds for converting light in the predetermined wavelength region into light in different wavelength regions, wherein the wavelength-converted layer comprises at least two resin layers containing the different phosphors, respectively, and wherein the at least two resin layers comprise a first resin layer containing first phosphors and a second resin layer containing at least one second phosphor, the first resin layer comprises a first convex meniscus-shaped upper surface located in an inner region on the upper surface of the LED chip, and the second resin layer is formed on the first resin layer and comprises a second convex meniscus-shaped upper surface whose boundary is defined by an edge of the upper surface of the LED chip.
地址 Suwon-Si KR