发明名称 Semiconductor system assemblies and methods of operation
摘要 An exemplary semiconductor processing system may include a remote plasma source coupled with a processing chamber having a top plate. An inlet assembly may be used to couple the remote plasma source with the top plate and may include a mounting assembly, which in embodiments may include at least two components. The inlet assembly may further include a precursor distribution assembly defining a plurality of distribution channels fluidly coupled with an injection port.
申请公布号 US9287095(B2) 申请公布日期 2016.03.15
申请号 US201314108692 申请日期 2013.12.17
申请人 Applied Materials, Inc. 发明人 Nguyen Andrew;Ramaswamy Kartik;Nemani Srinivas;Howard Bradley;Vishwanath Yogananda Sarode
分类号 H01J37/32;H01L21/3065;H01L21/311;H01L21/3213 主分类号 H01J37/32
代理机构 Kilpatrick Townsend & Stockton LLP 代理人 Kilpatrick Townsend & Stockton LLP
主权项 1. A semiconductor processing system comprising: a remote plasma source; a processing chamber having a top plate having a first surface, and defining a recess within the first surface; and an inlet assembly coupling the remote plasma source with the top plate and comprising: a precursor distribution assembly defining a plurality of distribution channels fluidly coupled with an injection port, and a mounting assembly comprising: a gas block coupled between the remote plasma source and the precursor distribution assembly, anda mounting block coupled between the precursor distribution assembly and the top plate, wherein the mounting block extends past the first surface of the top plate to couple with the top plate within the recess.
地址 Santa Clara CA US