发明名称 レーザ加工装置
摘要 A laser processing device including: a laser oscillator; a processing table; a transmission optical system for transmitting laser light emitted from the laser oscillator to the processing table; a processing head for condensing and radiating the laser light transmitted via the transmission optical system to an object to be processed; a moving mechanism for changing a relative position between the object to be processed and the laser light to be radiated to the object to be processed; and a variable curvature spherical mirror. The transmission optical system includes a reflective beam expander mechanism for collimating and magnifying the laser light from the laser oscillator. The reflective beam expander mechanism includes a spherical mirror and a concave mirror having different curvatures in two orthogonal axes.
申请公布号 JP5885173(B2) 申请公布日期 2016.03.15
申请号 JP20140521265 申请日期 2013.05.31
申请人 三菱電機株式会社 发明人 中村 直幸;山本 達也;西前 順一;藤川 周一;瀬口 正記;西尾 彰倫;村井 博幸;猿田 健児
分类号 B23K26/064;B23K26/00;B23K26/073;B23K26/08;H01S3/00;H01S3/10 主分类号 B23K26/064
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