发明名称 スプライシングテープおよびスプライシング処理方法ならびに電子部品実装装置
摘要 The invention provides a connection band, a connection processing method and an electronic element installing device. The connection band can have two functions of blocking a guide hole in the front half part and opening the guide hole in the rear half part. The connection band is provided with a first connection part (61) adhered on the tail end part of the first carrier band (14A); a second connection part (62) adhered on the head end of a second carrier band (14B); a closing part (61a) closing the guide hole (17) of the first carrier band and formed in the first connection part; and cut part (62a) formed on in the second connection part and used for opening the guide hole (17) of the second carrier band.
申请公布号 JP5885498(B2) 申请公布日期 2016.03.15
申请号 JP20110284730 申请日期 2011.12.27
申请人 富士機械製造株式会社 发明人 今井 美津男
分类号 H05K13/02 主分类号 H05K13/02
代理机构 代理人
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