发明名称 エポキシ樹脂混合物、エポキシ樹脂組成物、プリプレグおよびそれらの硬化物
摘要 The present invention provides an epoxy resin having a curing product that has a high thermal conductivity, and having a low viscosity and superior workability. The epoxy resin contains an epoxy resin (A) obtained by reacting epihalohydrin and a phenol compound (a) obtained by reacting the compounds represented by formula (1) and formula (6), and further contains: an epoxy resin (B) obtained by reacting epihalohydrin to the phenol compound (b) represented by formula (7); and/or an epoxy resin (C) obtained by reacting epihalohydrin and the phenol compound (c) represented by formula (8).
申请公布号 JP5885331(B2) 申请公布日期 2016.03.15
申请号 JP20110163830 申请日期 2011.07.27
申请人 日本化薬株式会社 发明人 川井 宏一;中西 政隆;井上 一真;江原 清二
分类号 C08G59/20;C08G59/62;C08J5/24;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/20
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