发明名称 半導体装置の評価装置
摘要 A semiconductor device assessment apparatus that electrically assesses a semiconductor device formed on a semiconductor substrate includes a holding unit having a surface to hold the semiconductor substrate thereon, and a detection unit to detect irregularity on the surface of the holding unit. The holding unit on the surface includes a plurality of grooves formed such that when the semiconductor substrate is held on the surface, the grooves overlap a periphery of the semiconductor substrate and also have a portion located outer than the periphery of the semiconductor substrate.
申请公布号 JP5885701(B2) 申请公布日期 2016.03.15
申请号 JP20130107123 申请日期 2013.05.21
申请人 三菱電機株式会社 发明人 秋山 肇;岡田 章;山下 欽也
分类号 H01L21/66;H01L21/683 主分类号 H01L21/66
代理机构 代理人
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