发明名称 積層チップ共振器
摘要 <P>PROBLEM TO BE SOLVED: To provide a laminate chip resonator which can be more small-sized and is capable of maintaining an excellent performance even if metal wiring is present in a mount board or the like. <P>SOLUTION: A laminate chip resonator comprises a plurality of ceramics sintered layers 2 each of which is formed from a mixed material adding a dielectric material and a magnetic material thereto and laminated, a plurality of coil-shaped conductor patterns 3 which are provided between the ceramics sintered layers and connected with each other via through holes H, and a magnetic layer 4 which is laminated under the bottom ceramics sintered layer and formed from a magnetic material of a metal oxide or from a material mixing the magnetic material and a glass material of a sintering additive. The laminate chip resonator is chip-shaped as a whole and on a pair of side faces which are confronted with each other, a pair of terminal electrodes 5 are provided which are connected to end portions of the coil-shaped conductor patterns. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5884968(B2) 申请公布日期 2016.03.15
申请号 JP20110241516 申请日期 2011.11.02
申请人 三菱マテリアル株式会社 发明人 西澤 薫;古賀 譲二;松本 文夫;乾 信一郎
分类号 H01F27/00;H01F17/00 主分类号 H01F27/00
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