Ball grid array package substrate with through holes and method of forming same

摘要

In accordance with an embodiment, there is provided a substrate of a ball grid array package that includes a first layer including reinforcement fibers. The reinforcement fibers reinforce the first layer such that the first layer has a higher tensile strength relative to a layer in the ball grid array package that is free of reinforcement fibers. In an embodiment, the substrate comprises a second layer disposed adjacent to the first layer with the second layer being free of reinforcement fibers. In an embodiment, the substrate also includes a through hole penetrating each of the first layer and the second layer. The through hole penetrates each of the first layer and the second layer based on each of the first layer and the second layer having been drilled in accordance with a mechanical drilling process.

主权项

1. A substrate of a ball grid array package, the substrate comprising:
a first layer including reinforcement fibers, wherein the first layer has (i) a first surface and (ii) a second surface substantially parallel to the first surface, and wherein the reinforcement fibers reinforce the first layer such that the first layer has a higher tensile strength relative to a layer in the ball grid array package that is free of reinforcement fibers; a second layer disposed adjacent to the first surface of the first layer, wherein the second layer is free of reinforcement fibers; a third layer disposed adjacent to the second surface of the first layer, wherein the third layer is free of reinforcement fibers; and a through hole penetrating each of the first layer, the second layer, and the third layer.