发明名称 Sealed battery cell and manufacturing method thereof
摘要 A sealed battery cell including an anti-explosion mechanism disposed between an electrode group and a top cover, and that deforms or cleaves due to elevation of internal pressure in the battery cell, the electrode group being comprised of a positive electrode and a negative electrode that are laminated together; wherein the anti-explosion mechanism includes a diaphragm, a connection plate welded to the diaphragm, and a connection lead welded to the connection plate; and the connection plate includes a thinner portion where a spot at which the connection lead is connected is formed as thin, and a thicker portion where the thinner portion is not formed, and a lower surface of the thinner portion is formed as coincident with a lower surface of the thicker portion, or as hollowed out from the lower surface of the thicker portion.
申请公布号 US9287587(B2) 申请公布日期 2016.03.15
申请号 US201113012528 申请日期 2011.01.24
申请人 Hitachi Automotive Systems, Ltd. 发明人 Suzuki Katsunori;Takasaki Yukio;Matsumoto Sho
分类号 H01M2/12;H01M10/0587;H01M10/052 主分类号 H01M2/12
代理机构 Crowell & Moring LLP 代理人 Crowell & Moring LLP
主权项 1. A sealed battery cell comprising: an anti-explosion mechanism disposed between an electrode group and a top cover, the electrode group including a positive electrode and a negative electrode that are laminated together; wherein the anti-explosion mechanism comprises a diaphragm, a connection plate comprising a lower surface and an upper surface that is welded to the diaphragm, and a connection lead welded to the lower surface of the connection plate; the connection plate includes a thinner portion having a flat upper surface across an entirety of the thinner portion, the flat upper surface being recessed below an upper surface of adjacent portions of the connection plate, the thinner portion being thinner than portions of the connection plate immediately adjacent thereto; a lower surface of the thinner portion is coplanar with the lower surface of the portions of the connection plate immediately adjacent to the thinner portion, and comprises a welded portion where the connection lead is welded directly to the lower surface of the thinner portion; and a thickness ratio between the thinner portion and a thickest portion of the connection plate is from 0.5 to 0.9.
地址 Hitachinaka-shi JP