Packaging devices and methods for semiconductor devices

摘要

Packaging devices and methods for semiconductor devices are disclosed. In some embodiments, a packaging device for a semiconductor device includes a packaging substrate including a semiconductor device mounting region. The packaging device includes a stress isolation structure (SIS) disposed on the packaging substrate proximate a portion of a perimeter of the semiconductor device mounting region.

主权项

1. A packaging device for a semiconductor device, comprising:
a packaging substrate having a first semiconductor device mounted in a first semiconductor device mounting region of the packaging substrate, and a second semiconductor device mounted in a second semiconductor device mounting region; a stress isolation structure (SIS) disposed on the packaging substrate proximate a perimeter of each of the first and the second semiconductor device mounting regions; and a cover over the SIS and the packaging substrate, the cover extending beyond a boundary of the SIS, a perimeter portion of the cover being attached to the packaging substrate, the perimeter portion of the cover enclosing the SIS, the cover having a first thickness over the first semiconductor device and a second thickness over the second semiconductor device, the second thickness being different from the first thickness, a composition of the cover being the same along a center axis of the cover, the center axis extending from a lowermost surface of the cover to an uppermost surface of the cover.