| 摘要 |
According to the present invention, a method for separating a protective tape separates a surface protective tape from a surface of a semiconductor wafer, by attaching a separation tape on the surface protective tape of the semiconductor wafer in high precision. The method separates the protective tape in a state that a part of a circumferential part of the protective tape is deformed elastically, by pressurizing a first separation member having a counter plane contacting a surrounding side of the protective tape to the corresponding surrounding side. After retreating the first separation member, the method separates the protective tape from the semiconductor wafer by integrating the protective tape, by separating the corresponding separation t ape as attaching the separation tape by a second separation member. |
