| 摘要 |
The present invention relates to a roller bar apparatus for removing puddles that gather and form a water film on a substrate via high-pressure vacuum suction in a wet etching process of a printed circuit board (PCB). The roller bar apparatus for removing puddles on the PCB in the wet etching process of the PCB comprises: a suction device having a plurality of through-holes at a low end and forming vacuum pressure; suction bars coupled to the bottom of the suction device at constant intervals and having a plurality of suction holes to extract etchant forming the water film on the PCB; and free rollers axially coupled to rotate between the suction bars, wherein bottom sides of the suction bars are not in contact with the PCB and the free rollers rotate in contact with the PCB. The roller bar apparatus can minimize the loss of vacuum between the suction bars coupled to the bottom of the suction device and the PCB and evenly remove the puddles on a surface of the PCB with application of a booster forming high-pressure vacuum, thereby improving uniformity. In addition, by the free rollers, which become in contact with the surface of the PCB and rotate together with upper transfer rollers and lower transfer rollers, it is possible to prevent the PCB from being caught. Moreover, it is possible to remedy the problems of losses of substrates and a low operation rate in in-lined PCB processing equipment, easily to secure a space by installing the suction roller device, and to eliminate a cause of the degradation of quality caused by disturbing the flow of the etchant. |
