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发明名称
半導体装置の製造方法、それにより得られる半導体装置及びそれに用いる熱硬化性樹脂組成物
摘要
申请公布号
JP5884477(B2)
申请公布日期
2016.03.15
申请号
JP20110285750
申请日期
2011.12.27
申请人
日立化成株式会社
发明人
福住 志津;蔵渕 和彦;名越 俊昌;田中 恵生
分类号
H01L23/28;H01L23/12;H01L25/10;H01L25/11;H01L25/18
主分类号
H01L23/28
代理机构
代理人
主权项
地址
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