| 摘要 |
The present invention relates to a printed circuit board with a low thermal resistance, and a manufacturing method thereof. The printed circuit board comprises: a board composed of a first metal material, and having a plurality of concave units provided in an upper surface formed as an uneven structure; an insulating layer formed by filling an insulating material in the concave unit of the upper surface of the board; a chip mounted area formed by coating a second metal material on an area where the insulating layer does not formed from the upper surface of the board; and an electrode installed area formed by coating the second metal material on the insulating layer. The electrode installed area is electrically insulated with the board and the chip mounted area. |
