Method of manufacturing a semiconductor device

摘要

For the manufacturing of semiconductor devices, in which multiple semiconductor chips which are mounted on a wiring substrate are processed for block molding and thereafter the wiring substrate is diced into individual resin-molded semiconductor devices, disclosed herein is a technique for easily determining the position of each resin-molded semiconductor device in its former state on the wiring substrate even after the dicing process. The processing steps include implementing the block molding with resin for multiple semiconductor chips mounted on a wiring substrate and thereafter dicing the wiring substrate into individual resin-molded semiconductor devices, with the substrate dicing step being preceded by a step of appending an address information pattern to each of the resin-molded semiconductor devices.

主权项

id="REI-00001" date="20160315" 1. A method of manufacturing a semiconductor device including processing steps of implementing the block molding with resin for a plurality of semiconductor chips which are mounted on a wiring substrate and thereafter dicing the wiring substrate into a plurality of resin-molded semiconductor devices,
wherein said method further includes a step, which precedes said substrate dicing step, of appending address information to each of the resin-molded semiconductor devices.