| 摘要 |
The present invention relates to an apparatus for detecting a leakage solution, enabling to have an even resistance value by forming a conductive line with a sputtering method on the upper surface of a base film layer, and preventing the upper protective film layer from being easily separated by enabling the conductive line with a sputtering method to have the thickness less than or equal to 1 μm. In addition, the apparatus is capable of detecting the leakage of various solution, by progressing the sputtering process by different metals, laminating the other conductive line on the upper surface of the conductive line, and forming the same. |
