| 发明名称 | Light emitting device module | ||
| 摘要 | A light emitting device module is provided comprising a light emitting device package, a printed circuit board on which the light emitting device package is arranged and a sealing member that surrounds the light emitting device package and the printed circuit board, wherein a predetermined space is formed between the light emitting device package and the printed circuit board and the sealing member. | ||
| 申请公布号 | US9285083(B2) | 申请公布日期 | 2016.03.15 |
| 申请号 | US201113085945 | 申请日期 | 2011.04.13 |
| 申请人 | LG INNOTEK CO., LTD. | 发明人 | Lee GunKyo |
| 分类号 | F21V9/00;F21S4/00;F21K99/00;F21V31/00;H05K3/28;F21Y101/02;F21Y103/00 | 主分类号 | F21V9/00 |
| 代理机构 | Ked & Associates, LLP | 代理人 | Ked & Associates, LLP |
| 主权项 | 1. A light emitting device module comprising: a light emitting device package having an upper surface and a lateral surface; a printed circuit board on which the light emitting device package is arranged; and a sealing member that surrounds the light emitting device package and the printed circuit board, the sealing member being a sheet, wherein the sealing member directly contacts the upper surface and an upper portion of the lateral surface and extends downward while directly contacting the lateral surface of the light emitting device package, and wherein the sealing member extends from the upper portion of the lateral surface of the light emitting device package to a surface of the printed circuit board between the light emitting device package and another light emitting device package at a prescribed distance from a lower portion of the light emitting device package to form a prescribed space between the light emitting device package, the printed circuit board and the sealing member. | ||
| 地址 | Seoul KR | ||