发明名称 基板処理方法及び装置
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing method and device capable of performing supercritical dry processing without generating faults, such as pattern collapse.SOLUTION: According to the substrate processing method, ultrapure water is supplied on a surface of a substrate. On the surface of the substrate on which the ultrapure water is adhered, a solvent containing alcoholic fluoride is supplied. On the surface of the substrate on which the solvent containing alcoholic fluoride is adhered, a first solvent having dissolubility to the solvent containing alcoholic fluoride and different from the solvent containing alcoholic fluoride is supplied. The substrate on which the first solvent is adhered is introduced into a chamber, and the first solvent on the surface of the substrate is replaced with supercritical fluid, and then a pressure in the chamber is reduced to change the supercritical fluid into the gas. The substrate is ejected from the chamber.
申请公布号 JP5885794(B2) 申请公布日期 2016.03.15
申请号 JP20140169823 申请日期 2014.08.22
申请人 株式会社東芝 发明人 林 秀和;佐藤 洋平;大口 寿史;冨田 寛
分类号 H01L21/304 主分类号 H01L21/304
代理机构 代理人
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