| 发明名称 | Temperature compensated crystal oscillator | ||
| 摘要 | The temperature compensated crystal oscillator has a rectangular substrate, a frame which is provided on an upper surface of the substrate, a mounting frame which has joining pads which are provided along an outer circumferential edge of the upper surface and which is provided on a lower surface of the substrate by bonding of joining terminals which are provided along the outer circumferential edge of the lower surface of the substrate and the joining pads, a crystal element which is mounted on an electrode pad which is provided on the upper surface of the substrate in a region surrounded by the frame, an integrated circuit element which has a temperature sensor and which is mounted on a connection pad which is provided on the lower surface of the substrate in a region surrounded by the mounting frame, and a lid which is joined to the upper surface of the frame. | ||
| 申请公布号 | US9287882(B2) | 申请公布日期 | 2016.03.15 |
| 申请号 | US201414532205 | 申请日期 | 2014.11.04 |
| 申请人 | KYOCERA CRYSTAL DEVICE CORPORATION | 发明人 | Yokoo Yoshiaki;Kenjo Harushi;Takai Shota |
| 分类号 | H01L41/047;H01L41/053;H01L41/083;H03H9/05;H03H9/17;H03B5/32;H03L1/02;H01L41/09;H03H9/10 | 主分类号 | H01L41/047 |
| 代理机构 | Westerman, Hattori, Daniels & Adrian, LLP | 代理人 | Westerman, Hattori, Daniels & Adrian, LLP |
| 主权项 | 1. A temperature compensated crystal oscillator comprising: a rectangular substrate, a frame which is provided on an upper surface of the substrate, a mounting frame which has joining pads which are provided along an outer circumferential edge of the upper surface and which is provided on a lower surface of the substrate by bonding of joining terminals which are provided along the outer circumferential edge of the lower surface of the substrate and the joining pads, a crystal element which is mounted on an electrode pad which is provided on the upper surface of the substrate in a region which is surrounded by the frame, an integrated circuit element which has a temperature sensor and which is mounted on a connection pad which is provided on the lower surface of the substrate in a region which is surrounded by the mounting frame, and a lid which is joined to the upper surface of the frame, wherein the mounting frame has: an insulation substrate which has an opening for arranging the integrated circuit element therein and is provided with the joining pads on its upper surface and a solder resist which covers the insulation substrate while exposing the joining pads, and an inner circumferential surface of the opening has first nonarrangement region in which the solder resist is not arranged. | ||
| 地址 | Higashine-shi JP | ||