发明名称 Memory device, memory module including the memory device, method of fabricating the memory module, and method of repairing the memory module
摘要 A memory module is provided. A plurality of DRAMs is mounted on a PCB. At least one DRAM has an operating parameter different from other DRAMs according to a position where the at least one DRAM is mounted on the PCB.
申请公布号 US9286956(B2) 申请公布日期 2016.03.15
申请号 US201414320796 申请日期 2014.07.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 Kang Dan-Kyu;Kang Sang-Seok;Ahn Young-Man
分类号 G11C17/00;G11C7/10;G11C16/32;G11C5/02;G11C11/406;G11C7/22;G11C11/4076 主分类号 G11C17/00
代理机构 F. Chau & Associates, LLC 代理人 F. Chau & Associates, LLC
主权项 1. A memory module, comprising: a register disposed at a center region of the memory module; a first DRAM disposed at a first distance from the register, wherein the first DRAM operates at a first operating parameter; and a second DRAM disposed at a second distance from the register, wherein the second DRAM operates at a second operating parameter, wherein the first operating parameter is different from the second operating parameter, and wherein the first operating parameter and the second operating parameter are set according to respective positions of the first DRAM and the second DRAM from the register.
地址 Suwon-Si, Gyeonggi-Do KR