Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same

摘要

A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 10 to 100 parts by weight of benzoxazine resin; (C) 5 to 50 parts by weight of diallylbisphenol A resin; and (D) 0.05 to 20 parts by weight of an amine curing agent. The halogen-free resin composition includes specific ingredients and proportions thereof to attain low dielectric constant (Dk), low dissipation factor (Df), high heat resistance, and high flame retardation. The halogen-free resin composition is suitable for producing a prepreg or a resin film and thus applicable to copper clad laminates and printed circuit boards.

主权项

1. A halogen-free resin composition, comprising:
(A) 100 parts by weight of epoxy resin, wherein the epoxy resin is at least one selected from the group consisting of isocyanate ester modified epoxy resin, dicyclopentadiene epoxy resin, and biphenyl novolac epoxy resin; (B) 20 to 70 parts by weight of benzoxazine resin, wherein the benzoxazine resin is bisphenol A benzoxazine resin, bisphenol F benzoxazine resin, or their combination; (C) 10 to 15 parts by weight of diallylbisphenol A resin; and (D) an amine curing agent, wherein the amine curing agent is 1 to 13 parts by weight of one selected from the group consisting of diamino diphenyl sulfone (DDS) and diamino diphenyl methane (DDM), or wherein the amine curing agent is 1 to 1.5 parts by weight of dicyandiamide (DICY).