Dummy flip chip bumps for reducing stress

摘要

A device includes a metal pad over a substrate. A passivation layer includes a portion over the metal pad. A post-passivation interconnect (PPI) is electrically coupled to the metal pad, wherein the PPI comprises a portion over the metal pad and the passivation layer. A polymer layer is over the PPI. A dummy bump is over the polymer layer, wherein the dummy bump is electrically insulated from conductive features underlying the polymer layer.

主权项

1. A method comprising:
forming a first package component comprising:
forming a first dielectric layer; andforming a dummy bump over the first dielectric layer, with an entirety of a bottom surface of the dummy bump contacting a top surface of the first dielectric layer; and bonding a second package component to the first package component, with the dummy bump in contact with the second package component, wherein after the bonding, a top surface of the dummy bump is in contact with a second dielectric layer in the second package component, with the first dielectric layer and the second dielectric layer contacting opposite surfaces of the dummy bump.