Package structure with direct bond copper substrate

摘要

A package structure includes a first insulation layer, a first conductive layer, a direct bond copper substrate, and a first electronic component. A first conductive via is formed in the first insulation layer. The first conductive layer is disposed on a top surface of the first insulation layer and in contact with the first conductive via. The direct bond copper substrate includes a second conductive layer, a third conductive layer and a ceramic base. The ceramic base is disposed on a bottom surface of the first insulation layer and exposed to the first insulation layer by press-fit operation. The first electronic component is embedded within the first insulation layer and disposed on the second conductive layer. The first electronic component includes a first conducting terminal. The first conducting terminal is electrically connected with the second conductive layer and/or electrically connected with the first conductive layer through the first conductive via.

主权项

1. A package structure, comprising:
a first insulation layer, wherein at least one first conductive via is formed in the first insulation layer; a first conductive layer disposed on a top surface of the first insulation layer and in contact with the at least one first conductive via; a direct bond copper substrate comprising a second conductive layer, a third conductive layer and a ceramic base, wherein the ceramic base is disposed on a bottom surface of the first insulation layer and exposed to the first insulation layer by a press-fit operation and comprises a first side surface and a second side surface opposite the first side surface exposed to surroundings, the second conductive layer is disposed on a top surface of the ceramic base and embedded within the first insulation layer, and the third conductive layer is disposed on a bottom surface of the ceramic base; and at least one first electronic component embedded within the first insulation layer and attached on the second conductive layer through a fixing material, wherein the first electronic component comprises at least one first conducting terminal, and the at least one first conducting terminal is electrically connected with the second conductive layer and/or electrically connected with the first conductive layer through the at least one first conductive via.