Optical device and method for manufacturing same

摘要

The present invention relates to an optical device and a method for manufacturing the same. The technical object of the invention is to realize a surface emitting body which allows heat generated from a light-emitting chip to be easily dissipated, eliminates the need for an additional wiring layer, and allows a singular light emitting chips or a plurality of light emitting chips to be arranged in series, in parallel, or in series-parallel. The present invention discloses an optical device comprising: a substrate; a plurality of light emitting chips disposed on the substrate; a plurality of conductive wires which electrically connect the substrate with the light emitting chips such that the plurality of light emitting chips are connected to each other in series, in parallel or in series-parallel; and a protective layer which covers the plurality of light emitting chips and the plurality of conductive wires on the substrate.

主权项

1. A light emitter device package, the package comprising:
a metal body formed from a single substrate of material having a top surface and a bottom surface; at least one light emitter device mounted to the top surface of the metal body; and wherein the metal body includes an anodized isolated region formed from the top surface to the bottom surface by anodizing the single substrate of material, wherein the anodized isolated region is disposed between a first isolated portion and a second isolated portion of the metal body, and wherein an adhesive insulation member is provided inside the anodized isolated region.