| 发明名称 | Dicing die-bonding film and method of forming a cut on the dicing die-bonding film | ||
| 摘要 | A dicing die-bonding film and a method of forming a groove in a dicing die-bonding film, the film including a base film; a pressure-sensitive adhesive layer stacked on the base film; and a bonding layer stacked on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer includes a first region overlapping with the bonding layer, and a second region not overlapping with the bonding layer, the second region including a third region adjacent to the first region, and a fourth region adjacent to the third region and having a groove formed therein. | ||
| 申请公布号 | US9287217(B2) | 申请公布日期 | 2016.03.15 |
| 申请号 | US201414315495 | 申请日期 | 2014.06.26 |
| 申请人 | CHEIL INDUSTRIES, INC. | 发明人 | Park Baek Soung;Choi Jae Won;Kim Sung Min;Kim In Hwan;Lee Jun Woo;Im Su Ml |
| 分类号 | H01L23/544;H01L21/70;C09J7/02;H01L21/683;H01L23/00 | 主分类号 | H01L23/544 |
| 代理机构 | Lee & Morse, P.C. | 代理人 | Lee & Morse, P.C. |
| 主权项 | 1. A dicing die-bonding film, comprising: a base film; a pressure-sensitive adhesive layer stacked on the base film; and a bonding layer stacked on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer includes: a first region overlapping with the bonding layer, and a second region not overlapping with the bonding layer, the second region including: a third region adjacent to the first region, anda fourth region adjacent to the third region and having a groove formed therein. | ||
| 地址 | Gumi-si, Kyeongsangbuk-do KR | ||